№ lp_2_1_15426
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Character count: 4496
File size: 208 KB
Teacher guidance document providing assessment criteria, model answers and commentary on misconceptions related to metallic bonding within secondary chemistry specifications.
Series:
Review My Learning
Subject:
Chemistry
Topic:
Metallic bonding
Educational level:
14–16 specifications
Type of document:
Teacher guidance and answer key
Organisation:
Royal Society of Chemistry
Publisher:
Royal Society of Chemistry
Components:
Worksheet overview, model answers, guidance on misconceptions
Assessment focus:
Interpreting diagrams, electrostatic forces, delocalised electrons, electrical conductivity
Intended audience:
Teachers and non-subject specialists
Associated materials:
Metallic Bonding worksheet, Bonding worksheets
Scope:
Single-level scaffolded worksheet with extension tasks
Price: 8 / 10 USD
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The product description is provided for reference. Actual content and formatting may differ slightly.
Year:
2021
Region / city:
Noordwijk, The Netherlands
Topic:
Space product assurance, metallic powder bed fusion technologies
Document type:
Standard
Organization / institution:
European Space Agency (ESA)
Author:
ECSS-Q-ST-70-80C Working Group
Target audience:
Space industry professionals
Effective period:
N/A
Approval date:
N/A
Amendment date:
N/A
Year:
2020
Region / city:
Hampton, VA
Topic:
Additive Manufacturing, Metallic Powder Core Tubular Wire
Document Type:
Research Paper
Organization / Institution:
NASA Langley Research Center, Colorado School of Mines
Author:
Marcia Domack
Target Audience:
Researchers, Engineers, Academics in Additive Manufacturing
Period of Validity:
2020
Approval Date:
November 18-20, 2020
Date of Modifications:
N/A
Subject:
Science
Grade Level:
9
Topic:
Heat Treatment of Metals
Type of Document:
Laboratory Experiment Instructions
Focus Material:
Iron
Key Concepts:
Tempering, Hardness, Brittleness, Malleability
Materials:
Metal paper clips, crucible tongs, Bunsen burner, heat-resistant pad, beaker, cold water
Safety Requirements:
Safety eyewear, careful handling of hot metal and open flame
Experimental Variables:
Heat treatment method, cooling rate, number of bends before breaking
Data Collection:
Tables for bends count and observational notes
Sections Included:
Introduction, Purpose, Materials, Safety Precautions, Question, Hypothesis, Procedure, Observations, Analysis, Conclusion
Subject:
Chemistry
Topic:
Chemical bonding and atomic structure
Document type:
Educational workbook
Educational level:
Secondary education
Content focus:
Ions, isotopes, atomic models, ionic bonding, giant ionic lattices
Includes:
Explanatory text, worked examples, practice questions, calculation tasks, diagram instructions
Chemical elements referenced:
Lithium, Sodium, Potassium, Magnesium, Aluminium, Oxygen, Fluorine, Chlorine, Nitrogen, Boron, Beryllium, Sulphur, Calcium, Rubidium
Assessment component:
Exam-style questions and model answers
Year:
2020
Region / City:
United States
Theme:
Cryogenic Engineering
Document Type:
Technical Specification
Organization / Institution:
Fermilab
Authors:
Michael Geynisman, Mark Adamowski, John Anderson Jr., David Montanari, Michael White
Target Audience:
Engineers, Designers, and Technicians in Cryogenic and Structural Engineering
Period of Validity:
Ongoing
Approval Date:
January 2020
Revision Date:
January 2020
Modification History:
Updated requirements for quality control, added clarification on testing procedures, and modified terminology to align with industry standards
Description of Document:
Technical specification detailing the design, fabrication, quality control, testing, and maintenance standards for metallic membrane cryostats, including design guidelines, construction methods, and international code references.
Year:
2026
Region / City:
Mansfield, MA, USA; Tianjin, China
Topic:
Stem cell delivery, biomaterials, nanotechnology
Document Type:
Research article
Institution:
NanoVault, Hebei University of Technology
Author:
Thomas J. Webster
Target Audience:
Biomedical researchers, material scientists
Methods:
Additive manufacturing of metal nanoporous membranes, in vitro and in vivo studies
Key Findings:
Controlled nanopore size, inhibition of IgG, promotion of neovascularization, selective biomolecule passage
Funding:
NanoVault, Inc.
Applications:
Diabetes treatment, stem cell transplantation
Year:
2016
Date:
January 29, 2016
Time:
3:00–4:00 P.M.
Location:
EC2300 (Large Conference Room), Engineering Center
Institution:
Florida International University
Department:
Department of Mechanical and Materials Engineering
Organizing Unit:
Multidisciplinary Analysis, Inverse Design, Robust Optimization and Control (MAIDROC) Laboratory
Event Type:
Invited Lecture
Lecture Title:
Computational Materials Design Challenges for Metallic Materials
Lecturer:
David L. McDowell
Lecturer Affiliation:
Georgia Institute of Technology, Woodruff School of Mechanical Engineering and School of Materials Science and Engineering
Lecturer Position:
Regents’ Professor and Carter N. Paden, Jr. Distinguished Chair in Metals Processing; Executive Director, Institute for Materials
Organizer:
George S. Dulikravich
Research Field:
Computational Materials Science, Mechanical Engineering, Materials Engineering
Topic:
Multiscale modeling and computational design of metallic materials
Target Audience:
Faculty, researchers, and students in materials science and mechanical engineering
Region:
Miami, Florida, United States
Conference name:
The 2025 International Conference on the AI Revolution: Research, Ethics, and Society (AIR-RES 2025)
Year:
2025
Dates:
April 14–16, 2025
Location:
Luxor (an MGM Resorts International), Las Vegas, Nevada, USA
Venue address:
3900 Las Vegas Blvd South, Las Vegas, Nevada 89119, USA
Time zone:
USA Pacific Time Zone
Format:
Hybrid conference (on-site and online/Zoom)
Organizing body:
AIR-RES 2025 Steering Committee
Thematic areas:
Artificial intelligence, research, ethics, society, cybersecurity, publishing, education
Document type:
Conference schedule and program
Sessions included:
Opening remarks, keynote talks, technical sessions, poster sessions, online presentations
Target audience:
Researchers, academics, graduate students, conference participants
Publication note:
Presentation titles and author names extracted from submitted papers; final proceedings may differ
Source type:
Official conference program outlining dates, venues, sessions, and speakers for a hybrid international academic conference focused on artificial intelligence and its societal and ethical dimensions.
Year:
2017
Location:
Dells, Wisconsin, USA
Event:
Hockey Tournament
Divisions:
Green and Gold
Teams:
Evanston Wildkits, Chiefs Black, Falcons 4 Hockey, Chiefs Green, Arctic Fury 5, Glenview Bombers
Type of document:
Tournament results
Dates:
January 14–16, 2017
Format:
Preliminary rounds, championships, consolation games
Year:
2023
Location:
Budapest, Hungary
Venue:
Holocaust Memorial Center, H-1094 Budapest, Páva utca 39.
Organisers:
Holocaust Memorial Centre, Budapest; Yahad-in-Unum
Event Title:
7th “Holocaust by Bullets” Seminar for Teachers
Type of Source:
Application Form
Deadline for Application:
15 June 2023
Seminar Dates:
14–16 September 2023
Target Audience:
Teachers
Services Provided:
Meals, Accommodation, Travel Expense Compensation
Legal Reference:
Law CXII of 2011 on the right to self-determination as regards information and freedom of information
Contact Email:
[email protected]
Website:
www.hdke.hu
Organization:
Confederation of Canadian Unions (CCU-CSC)
Event:
31st Biennial Convention
Location:
Halifax, Nova Scotia, Canada
Convention Dates:
October 14–16, 2023
Document Type:
Delegate declaration form
Purpose:
Registration and certification of voting delegates and guests representing affiliated unions and locals
Related Regulation:
CCU-CSC Constitution, Article VIII
Maximum Voting Delegates:
10 per affiliate
Submission Deadline:
October 6, 2023
Convention Fee:
$100 per delegate or guest
Payment Deadline:
October 9, 2023
Payment Recipient:
CCU-CSC Treasurer
Treasurer:
Scarlett Farquhar
Contact Email:
[email protected]
Submitting Authority:
Local President or designated representative
Participating Organizations:
AESESCOTU-SCTTCMAWCUSWNSUPEPPWC – National; PPWC Local 1; PPWC Local 2; PPWC Local 8; PPWC Local 9; PPWC Local 15; PPWC Local 26; YUSA
Additional Requirement:
Identification of the delegate elected or appointed to the Resolutions Committee on Friday, October 13, 2023
Year:
2025
Region / City:
Goderich, ON, Canada
Theme:
Youth Outdoor Activities / Camping
Document Type:
Activity Registration Form
Organization:
Girl Guides of Canada
Responsible Guider:
[Not specified in document]
Target Audience:
Girl Guides participants and their parents/guardians
Activity Dates:
November 14–16, 2025
Location:
Camp Kintail, 85153 Bluewater Highway, R.R. #3, Goderich, ON, N7A 3X9
Planned Activities:
High Challenge Course, Archery, Disc Golf, Hiking, Outdoor Living Skills, Fire Building, Bannock Making, Campfire, Arts and Crafts, Team Building Activities
Third Party Service Provider:
Camp Kintail
Accommodation Type:
Camp Building / Meeting hall
Supervision Ratios:
1:5 for Embers, 1:7 for Guides, Pathfinders and Rangers, minimum 2 Guiders
Transportation Provided By:
Parent/guardian/caregiver
Year:
2006
Event:
1st National Nursing Informatics Conference 2005
Conference theme:
Nurses & Informatics: Transforming Healthcare
Conference dates:
September 14–16, 2005
Location:
University of Toronto, Ontario, Canada
Publication:
Canadian Journal of Nursing Informatics
Volume:
1
Issue:
1
Season:
Spring 2006
Session type:
Concurrent Sessions
Session theme:
Informatics Innovations in Nursing Practice
Document type:
Conference proceedings abstract
Authors:
Rebecca B. Espedido; Julie Pike
Author affiliation:
Toronto East General Hospital
Field:
Nursing Informatics
Topic:
Implementation of an Emergency Department Information System (EDIS)
Healthcare setting:
Urban community hospital emergency department
Key subjects:
electronic tracking system, triage documentation, patient flow management, clinical documentation systems, health information technology implementation
Year:
2026
Region / City:
Commercial building
Subject:
Grounding and bonding for telecommunications systems
Document type:
Specification
Organization / Institution:
Not specified
Author:
Not specified
Target audience:
Specification writers, telecommunications system designers
Effective period:
Not specified
Approval date:
Not specified
Modification date:
Not specified
Year:
2015
Region / City:
State of Georgia
Topic:
Insurance, Bonding, Procurement Guidelines
Document Type:
Guidelines
Author:
Risk Management Services
Target Audience:
State of Georgia Entities, Purchasing Officers, and Designated Buyers
Period of Validity:
November 2015 onwards
Approval Date:
November 2015
Date of Changes:
Not specified
Document type:
Technical specification section
Standard references:
ANSI/TIA-607-D; NFPA 70 (NEC); UL 497; UL 497A; IACS; BICSI ITSIMM
Subject:
Grounding and bonding requirements for communications systems
Industry:
Telecommunications infrastructure
Scope:
Customer premises communications installations
Components covered:
Bonding busbars; bonding conductors; grounding backbone; overvoltage surge protection
Materials specified:
Copper and copper alloy conductors and busbars
Testing requirements:
Ground resistance testing
Compliance requirements:
UL Listed; NRTL listed materials
Related sections:
Electrical grounding and bonding; communications cabinets and racks; cable trays
Note:
Year
Theme:
Electrical installations
Document Type:
Specification
Target Audience:
Contractors, engineers, electricians
Note:
Year
Year:
N/A
Region / City:
N/A
Topic:
Grounding and bonding for communications systems
Document Type:
Specification
Organization / Institution:
Harger Lightning and Grounding
Author:
N/A
Target Audience:
Design professionals
Period of Validity:
N/A
Approval Date:
N/A
Date of Amendments:
N/A
Document type:
Press release
Date:
November 19, 2024
Place of publication:
Singapore
Company:
ASMPT Limited
Division:
ASMPT Semiconductor Solutions (ASMPT SEMI)
Product:
AMICRA NANO
Topic:
Hybrid bonding and co-packaged optics manufacturing
Industry:
Semiconductor assembly and packaging
Spokesperson:
Dr. Johann Weinhändler
Contact information:
Global ASMPT Semiconductor Solutions Press Office; Global ASMPT Press Office