№ lp_2_1_10755
Corporate press release announcing the launch and technical specifications of the AMICRA NANO die and flip-chip bonder for hybrid bonding in co-packaged optics and advanced semiconductor applications.
Document type: Press release
Date: November 19, 2024
Place of publication: Singapore
Company: ASMPT Limited
Division: ASMPT Semiconductor Solutions (ASMPT SEMI)
Product: AMICRA NANO
Topic: Hybrid bonding and co-packaged optics manufacturing
Industry: Semiconductor assembly and packaging
Spokesperson: Dr. Johann Weinhändler
Contact information: Global ASMPT Semiconductor Solutions Press Office; Global ASMPT Press Office
Price: 8 / 10 USD
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