№ lp_1_2_10428
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The document provides detailed analysis of the optical properties of narrowband plasmonic filters integrated on-chip for multispectral imaging, including the effect of etch depth, metal film thickness, and fill factor on filter performance.
Year: 2026
Region / City: Zhengzhou, China
Topic: Optics, Plasmonics, Spectral Sensing
Document Type: Research Paper
Organization / Institution: Institute of Physics, Henan Academy of Sciences, Zhejiang Engineering Research Center of MEMS, Foshan University
Authors: Qilin Zheng, Li Liang, Shunji Yang, Luyang Tong, Wenqiang Wang, Jibo Tang, Yu Zhang, Bintong Huang, Xiaobo He
Target Audience: Researchers in optics and nanotechnology
Period of Validity: Not specified
Approval Date: Not specified
Modification Date: Not specified
Price: 8 / 10 USD
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Avian-eye-inspired perovskite artificial vision system for foveated and multispectral imaging
Year: 2024
Region / City: South Korea
Topic: Perovskite-based camera, object detection, multispectral imaging
Document Type: Press Release
Organization: Institute for Basic Science (IBS)
Authors: Jinhong Park, Min Seok Kim, Joonsoo Kim, Sehui Chang, Mincheol Lee, Gil Ju Lee, Young Min Song, Dae-Hyeong Kim
Target Audience: Researchers, scientists, engineers, media
Effective Period: May 29, 2024
Approval Date: May 29, 2024
Revision Date: Not specified
DOI: 10.1126/scirobotics.adk6903
Publication Date: May 29, 2024
Contact: Dae-Hyeong Kim ([email protected]), Young Min Song ([email protected])
Note: Description
Chip back potential is the level which bulk silicon is maintained by on-chip connection, or it is the level to which the chip back must be connected when specifically stated below. If no potential is given the chip back should be isolated.
Year: 2021
Region / city: Not specified
Topic: Semiconductor component specifications
Document type: Technical specification
Organization / institution: Fairchild
Author: Not specified
Target audience: Engineers and manufacturers
Period of validity: Not specified
Approval date: 10/5/21
Revision date: 7/1
Context description: A technical specification for semiconductor components detailing the chip back potential, material types, and manufacturing details.
Supplementary information of On-chip dual-microcomb based fiber-optic acoustic mapper
Year: 2026
Region / City: Chengdu, Shanghai, Beijing, China
Subject: Optical fiber acoustic sensing, dual-microcomb generation
Document type: Supplementary information
Institution: University of Electronic Science and Technology of China; Shanghai Jiao Tong University; China Electronics Technology Group Corporation
Authors: Xin-Yue He, Teng Tan, Bing Chang, Jin-Long Xiang, Zi-Yi Yang, Shang-Ce Wang, Ze-Ping Wang, Yu-Pei Liang, Heng Zhou, Yong-Jun Huang, Ying-Zhan Yan, Yi-Kai Su, Yun-Jiang Rao, Yu Wu, Xu-Han Guo, Bai-Cheng Yao
Target audience: Researchers in photonics and optical sensing
Period of validity: 2026
Corresponding author: [email protected]
Methodology: Numerical simulations, micro-ring soliton generation, Fabry-Perot cavity acoustic sensing
Key components: Si3N4 microrings, MEMS diaphragms, frequency combs, photodetectors
Applications: Optical acoustic mapping and sensing experiments
Type of source: Scientific supplementary material
Chip back potential is the level which bulk silicon is maintained by on-chip connection, or it is the level to which the chip back must be connected when specifically stated below.
Year: 2018
Region / City: Not specified
Topic: Semiconductor manufacturing
Document type: Technical specification
Organization / Institution: IXYS
Author: Not specified
Target audience: Engineers, semiconductor professionals
Effective period: Not specified
Approval date: 6/15/18
Modification date: Not specified
Mask Ref: IX11
Die size: .075” x .075”
Thickness: .012”
Backside Potential: DRAIN
Backside material: Ti/Ni/Au
Top material: Al
Part number: IXTD1R6N50
Manufacturing details: IXYS, DG 10.1.2Rev B, 7/1
Context: Technical specification for chip back potential in semiconductor manufacturing.
Supporting Information A Comprehensive Study of Plasmonic Mode Hybridization in Gold Nanoparticle-over-Mirror Arrays: Manipulation of Coupling and Dephasing Time
Year: 2023
Region / city: Sherbrooke, Waterloo, Varennes, Ontario, Québec, Canada
Theme: Plasmonic nanostructures, Coupling, Dephasing
Document type: Research Study, Scientific Paper
Organization / institution: Université de Sherbrooke, Infinite Potential Laboratories, University of Waterloo, INRS-Énergie
Author: Raphael Gherman, Sacha Schwarz, Jean-François Bryche, Guillaume Beaudin, Alex Currie, Pierre Levesque, François Fillion-Gourdeau, Steve G. MacLean, Dominique Drouin, Serge Ecoffey, Paul G. Charette
Target audience: Researchers, Academics, Engineers in Nanotechnology and Plasmonics
Period of validity: N/A
Approval date: N/A
Modification date: N/A
Context: This document presents experimental and simulated studies on plasmonic hybridization in gold nanoparticle-over-mirror arrays, focusing on coupling and dephasing times.
Topics: Multispectral On-Chip Plasmonic