№ files_lp_4_process_3_058578
File format: docx
Character count: 467
File size: 50 KB
Year:
2021
Region / city:
Not specified
Topic:
Semiconductor component specifications
Document type:
Technical specification
Organization / institution:
Fairchild
Author:
Not specified
Target audience:
Engineers and manufacturers
Period of validity:
Not specified
Approval date:
10/5/21
Revision date:
7/1
Context description:
A technical specification for semiconductor components detailing the chip back potential, material types, and manufacturing details.
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The product description is provided for reference. Actual content and formatting may differ slightly.
Year:
2026
Region / City:
Zhengzhou, China
Topic:
Optics, Plasmonics, Spectral Sensing
Document Type:
Research Paper
Organization / Institution:
Institute of Physics, Henan Academy of Sciences, Zhejiang Engineering Research Center of MEMS, Foshan University
Authors:
Qilin Zheng, Li Liang, Shunji Yang, Luyang Tong, Wenqiang Wang, Jibo Tang, Yu Zhang, Bintong Huang, Xiaobo He
Target Audience:
Researchers in optics and nanotechnology
Period of Validity:
Not specified
Approval Date:
Not specified
Modification Date:
Not specified
Year:
2026
Region / City:
Chengdu, Shanghai, Beijing, China
Subject:
Optical fiber acoustic sensing, dual-microcomb generation
Document type:
Supplementary information
Institution:
University of Electronic Science and Technology of China; Shanghai Jiao Tong University; China Electronics Technology Group Corporation
Authors:
Xin-Yue He, Teng Tan, Bing Chang, Jin-Long Xiang, Zi-Yi Yang, Shang-Ce Wang, Ze-Ping Wang, Yu-Pei Liang, Heng Zhou, Yong-Jun Huang, Ying-Zhan Yan, Yi-Kai Su, Yun-Jiang Rao, Yu Wu, Xu-Han Guo, Bai-Cheng Yao
Target audience:
Researchers in photonics and optical sensing
Period of validity:
2026
Corresponding author:
[email protected]
Methodology:
Numerical simulations, micro-ring soliton generation, Fabry-Perot cavity acoustic sensing
Key components:
Si3N4 microrings, MEMS diaphragms, frequency combs, photodetectors
Applications:
Optical acoustic mapping and sensing experiments
Type of source:
Scientific supplementary material
Year:
2018
Region / City:
Not specified
Topic:
Semiconductor manufacturing
Document type:
Technical specification
Organization / Institution:
IXYS
Author:
Not specified
Target audience:
Engineers, semiconductor professionals
Effective period:
Not specified
Approval date:
6/15/18
Modification date:
Not specified
Mask Ref:
IX11
Die size:
.075” x .075”
Thickness:
.012”
Backside Potential:
DRAIN
Backside material:
Ti/Ni/Au
Top material:
Al
Part number:
IXTD1R6N50
Manufacturing details:
IXYS, DG 10.1.2Rev B, 7/1
Context:
Technical specification for chip back potential in semiconductor manufacturing.
Year:
2026
Region / City:
N/A
Topic:
Quantum Computing
Document Type:
Scientific Publication
Organization / Institution:
HRL
Author:
N/A
Target Audience:
Researchers, Engineers, Scientists
Effective Period:
N/A
Approval Date:
N/A
Date of Changes:
N/A
Year:
2014
Region / city:
N/A
Topic:
Beam commissioning, Silicon Detector, SVT
Document type:
Technical procedure
Organization / institution:
N/A
Author:
N/A
Target audience:
Researchers, engineers
Period of validity:
N/A
Approval date:
N/A
Date of changes:
N/A
Type of document:
Shareholders Resolution
Jurisdiction:
United Arab Emirates
Free Zone Authority:
Dubai Silicon Oasis
Corporate Form:
Limited Liability Company
Subject:
Incorporation of a Free Zone Company and Appointment of Attorney
Share Capital:
AED ______ divided into ____ Shares of AED ___ each
Subscriber:
Corporate Shareholder
Officers Appointed:
Directors, General Manager, Secretary
Authorised Representative:
Appointed Attorney with full powers
Powers Granted:
Incorporation, licensing, share subscription and transfer, capital amendment, mortgage or pledge of shares, leasing of premises, banking operations, loans and credit facilities, delegation of authority
Execution:
Signed by Shareholders
Year:
2018
Region / City:
Not specified
Topic:
Semiconductor manufacturing
Document type:
Technical specification
Organization / Institution:
IXYS
Author:
Not specified
Target audience:
Engineers, semiconductor professionals
Effective period:
Not specified
Approval date:
6/15/18
Modification date:
Not specified
Mask Ref:
IX11
Die size:
.075” x .075”
Thickness:
.012”
Backside Potential:
DRAIN
Backside material:
Ti/Ni/Au
Top material:
Al
Part number:
IXTD1R6N50
Manufacturing details:
IXYS, DG 10.1.2Rev B, 7/1
Context:
Technical specification for chip back potential in semiconductor manufacturing.
Year:
2026
Region / City:
Sunnyvale, California, United States
Document Type:
Agreement
Organization / Institution:
Silicon Image, Inc.
Parties Involved:
Silicon Image, Inc. (ATC), Member (unspecified)
Purpose:
Establish terms for authorized testing services
Scope:
Testing of products under export control regulations
Terms Validity:
Effective as of signature date
Attachments:
Authorized Testing Center Terms and Conditions
Responsibilities:
Compliance with U.S. Export Administration Regulations and related laws
Delivery Terms:
Pre-paid delivery to ATC, Member responsible for shipping and insurance
Payment Terms:
Payment due prior to service performance, no discounts without written agreement
Year:
2026
Region / City:
Düsseldorf
Theme:
Electric hydrofoiling, boating, adventure
Document Type:
Press release
Organization / Institution:
Axopar, Flite
Author:
Flite
Target Audience:
Boaters, adventure enthusiasts, eFoil users
Validity Period:
Starting from April 2026
Approval Date:
N/A
Date of Changes:
N/A
Year:
2012
Region / City:
Ukraine
Topic:
HCV treatment access, harm reduction, public health policy
Document Type:
Research paper
Organization / Institution:
Alliance
Author:
Ludmila Maistat, Pavlo Skala, Tatiana Barnard, Nataliia Kravchenko
Target Audience:
Public health professionals, policymakers, medical community
Period of Action:
2012 and ongoing
Date of Approval:
Not specified
Date of Changes:
Not specified
Description:
This document details the outcomes of large-scale advocacy and demonstration treatment programs aimed at improving access to HCV treatment for people who inject drugs (PWIDs) in Ukraine, with a focus on policy changes and the integration of HCV treatment into harm reduction programs.
Year:
2025
Region / City:
Fermanagh Township, Juniata County, Pennsylvania
Topic:
Ordinance on ATV and Snowmobile Use
Document Type:
Ordinance
Organization / Institution:
Board of Supervisors of Fermanagh Township
Author:
Board of Supervisors of Fermanagh Township
Target Audience:
Residents of Fermanagh Township, individuals operating ATVs and snowmobiles
Effective Date:
March 10, 2025
Date of Approval:
March 10, 2025
Date of Amendments:
N/A
Year:
2017
Region / City:
Seminole County, Florida
Subject:
Criminal Law, Electronic Monitoring, Domestic Violence
Document Type:
Administrative Order
Author:
Seminole County Sheriff’s Office
Target Audience:
Law enforcement, criminal justice professionals
Period of Validity:
N/A
Approval Date:
2017
Date of Changes:
N/A
Note:
Year
Topic:
Scholarship
Document Type:
Personal Statement
Author:
Autumn Lemke
Target Audience:
Scholarship Committee
Contextual Description:
Personal reflection and gratitude for receiving a scholarship, highlighting family military history and its significance.
Year:
2018
Region / City:
Not specified
Topic:
Semiconductor manufacturing
Document type:
Technical specification
Organization / Institution:
IXYS
Author:
Not specified
Target audience:
Engineers, semiconductor professionals
Effective period:
Not specified
Approval date:
6/15/18
Modification date:
Not specified
Mask Ref:
IX11
Die size:
.075” x .075”
Thickness:
.012”
Backside Potential:
DRAIN
Backside material:
Ti/Ni/Au
Top material:
Al
Part number:
IXTD1R6N50
Manufacturing details:
IXYS, DG 10.1.2Rev B, 7/1
Context:
Technical specification for chip back potential in semiconductor manufacturing.
Year:
2015
Region / city:
South Africa
Topic:
Domestic Poultry Market, Trade Policies, Local Poultry Producers
Document type:
Parliamentary Question
Organization:
Department of Trade and Industry (dti), Department of Agriculture, Forestry and Fisheries (DAFF)
Author:
Mr J A Esterhuizen (IFP)
Target audience:
South African policymakers, poultry industry stakeholders
Period of validity:
Less than 6 months from approval
Approval date:
September 2014
Date of amendments:
N/A