№ files_lp_4_process_3_106733
Year: 2018
Region / City: Not specified
Topic: Semiconductor manufacturing
Document type: Technical specification
Organization / Institution: IXYS
Author: Not specified
Target audience: Engineers, semiconductor professionals
Effective period: Not specified
Approval date: 6/15/18
Modification date: Not specified
Mask Ref: IX11
Die size: .075” x .075”
Thickness: .012”
Backside Potential: DRAIN
Backside material: Ti/Ni/Au
Top material: Al
Part number: IXTD1R6N50
Manufacturing details: IXYS, DG 10.1.2Rev B, 7/1
Context: Technical specification for chip back potential in semiconductor manufacturing.
Price: 8 / 10 USD
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