№ files_lp_3_process_7_064381
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This paper discusses a novel process for fine-pitch face-to-back chip-on-wafer integration and its application in 3D heterogeneous systems.
Year:
2023
Region / city:
N/A
Subject:
Chip-on-Wafer integration, 3D heterogeneous systems, Cu–Cu hybrid bonding
Document Type:
Research Paper
Organization / Institution:
Sony
Author:
A. Urata et al.
Target Audience:
Researchers and professionals in semiconductor technologies
Period of Validity:
N/A
Approval Date:
N/A
Date of Changes:
N/A
Price: 8 / 10 USD
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The product description is provided for reference. Actual content and formatting may differ slightly.
Year:
2023
Region / city:
Córdoba, Argentina
Topic:
Cognitive science, Philosophy of representation
Document type:
Research paper
Organization:
UNC, IDH-CONICET
Author:
Mariela Aguilera
Target audience:
Scholars in cognitive science, philosophy, and neuroscience
Period of validity:
N/A
Approval date:
N/A
Modification date:
N/A
Year:
2022-2030
Region:
United States
Topic:
Environmental policy and transportation electrification
Document Type:
Supplementary material / research report
Institution:
University of Illinois, Department of Agricultural and Consumer Economics
Authors:
Jia Zhong, Madhu Khanna, Kalai Ramea
Target Audience:
Researchers and policymakers in energy, transportation, and agriculture sectors
Model:
BEPAM-V (Biofuel and Environmental Policy Analysis Model with Vehicle Choice)
Policy Scenarios:
EV tax credit, public charging station expansion
Methodology:
Partial equilibrium, open economy, multi-period modeling with Monte Carlo simulations
Data Sources:
National Household Travel Survey (2017), EIA (2019), state Renewable Portfolio Standards
Assumptions:
Corn ethanol mandate, binding RPS, heterogeneous consumer preferences, intangible and tangible costs of vehicles
Sensitivity Analysis:
Alternative ethanol blend rates and exclusion of intangible costs
Endogenous Outcomes:
Vehicle mix, fuel demand, electricity demand, social welfare, greenhouse gas emissions
Constraints:
Technology limits, material balance, policy constraints
Year:
N/A
Region / city:
N/A
Topic:
Heterogeneous Integration, Technology Innovation
Document Type:
Council Report
Organization / Institution:
N/A
Author:
N/A
Target audience:
Industry, Academia, Research Institutes, Government
Duration:
3 years
Approval date:
N/A
Amendment date:
N/A
Context description:
Document outlines the purpose and role of the HIR Global Advisory Council in guiding the Heterogeneous Integration International Roadmap Committee.
Year:
2026
Region / City:
United Kingdom
Theme:
Higher Education, Knowledge Exchange, Third Mission
Document Type:
Academic Article
Author:
Fumi Kitagawa, Mabel Sánchez Barrioluengo, Elvira Uyarra
Target Audience:
Academics, Policy Makers, Higher Education Institutions
Period of Action:
Post-financial crisis period
Approval Date:
Not specified
Date of Changes:
Not specified
Keywords:
Third Mission, University Strategies, Institutional Change, Knowledge Exchange
Year:
2023
Region / City:
Austin, TX, USA; Hong Kong
Topic:
Data Modeling, Bicycling Frequency, High Density Living
Document Type:
Research Paper
Author:
Chandra R. Bhat, Aupal Mondal
Target Audience:
Researchers, Urban Planners, Policy Makers
Period of Validity:
N/A
Date of Approval:
N/A
Date of Changes:
N/A
Year:
2026
Region / City:
International / Netherlands
Topic:
Semiconductors and Quantum Technologies
Document Type:
Project Proposal Application
Organization / Institution:
NWO (Netherlands Organization for Scientific Research)
Author:
Consortium of researchers and co-applicants
Target Audience:
Research consortia submitting proposals
Project Duration:
Variable, as per proposal
Submission Date:
As specified in the Call for Proposals
Funding Requested:
Specified in proposal summary
Co-funders:
Listed per project budget
Cooperation Partners:
Listed per proposal
Sections Included:
General project information, Problem analysis and impact, Route to impact, Consortium and productive interactions, Project governance, Research plan, Data management, Ethical aspects, Literature references, Annexes
Guidelines:
English language, Calibri font size 10, formatting restrictions, page limits, PDF submission instructions
Year:
2026
Region / Institution:
Chungnam National University, Daejeon, Republic of Korea
Subject:
Heterogeneous catalysis, Electrocatalysis, Computational chemistry
Document type:
Research lecture / Presentation
Author:
Hee-Joon Chun
Department:
Department of Chemistry
Target audience:
Researchers and students in chemistry and materials science
Methods:
Density Functional Theory, Ab initio molecular dynamics simulations
Catalysts studied:
Bimetals, metal oxides, carbides, graphite
Reactions discussed:
NO electrochemical reduction, CO2 hydrogenation to 1-butanol
Materials analyzed:
BaTiO3, TiO2
Focus:
Computational design of catalytic structures and reaction environment analysis
Date:
12/04/2024
Product name:
Tapiflex Excellence 19dB
Product category:
Heterogeneous poly(vinyl chloride) flooring on foam
Standard classification:
ISO 11638
Use class:
34/42
Total thickness:
3.25 mm
Wear layer thickness:
0.80 mm
Weight:
3250 g/m²
Indentation resistance:
≥0.10 mm
Slip resistance:
R10
Fire classification:
Bfl-s1 (glued over A1fl or A2fl substrate such as concrete)
Dimensional stability:
≤0.10%
Antistatic property:
≤2 kV
Chemical stain resistance:
Not affected (ISO 26987)
Cleanability evaluation method:
Fraunhofer method
Cleanability result:
Excellent
Bacteria resistance:
Does not promote growth (ISO 846 Part C)
Impact sound reduction:
≥19 dB
In-room impact noise classification:
Class A (<65 dB) according to NFS 31-074
Surface treatment:
Tektanium® matt surface treatment
Installation method:
Fully glued; flexible for coving up against the wall
Material composition:
Phthalate-free and biocide-free formulation
Recycled content:
At least 25% recycled material
Recycling program:
ReStart® take-back recycling program
Environmental declaration:
Environmental Product Declaration (EPD)
Material health verification:
Third-party verified Material Health Statement (MHS), evaluation threshold 0.01%
TVOC emissions after 28 days:
≤10 µg/m³ according to EN 16516
Sustainable building certifications:
LEED, BREEAM, WELL compatibility
Available documentation:
Technical Data Sheet; Green Building Card; Installation Guide; Maintenance Guide; Fire Report; EPD; MHS; DOP; Warranty
Manufacturer:
Tarkett
Plant certifications:
ISO 14001:2015; ISO 50001:2018; ISO 9001:2015; ISO 45001:2018
Year:
2009
Region / City:
United States
Topic:
VistA Messaging Services, HL7 Protocol
Document Type:
Manual
Organization / Institution:
Department of Veterans Affairs, VA Office of Information and Technology
Author:
REDACTED
Target Audience:
VistA developers, system managers
Effective Period:
N/A
Approval Date:
N/A
Amendment Date:
N/A
Year:
2012
Region / City:
Region 8
Topic:
Environmental Quality Assurance
Document Type:
Crosswalk
Organization / Institution:
Environmental Protection Agency (EPA)
Author:
EPA
Target Audience:
UFP-QAPP preparers, EPA reviewers, contractors
Period of Validity:
Up to 5 years from the date of approval
Approval Date:
Not specified
Date of Changes:
Not specified
Year:
2024
Region / City:
Brazil
Subject:
Pharmaceutical regulatory process
Document Type:
Checklist
Organization / Institution:
Anvisa
Author:
Not specified
Target Audience:
Pharmaceutical manufacturers, regulatory professionals
Period of Validity:
Not specified
Approval Date:
Not specified
Date of Changes:
Not specified
Year:
2012
Note:
Region / City
Subject:
Database Management, Data Integration
Document Type:
Technical Article
Organization / Institution:
Microsoft
Author:
Carla Sabotta, Debarchan Sarkar
Target Audience:
IT professionals, database administrators
Year:
2008–2021
Organization:
Microsoft
Document Type:
Technical Documentation
Subject:
XML-binary Optimized Packaging (XOP) Profile
Scope:
Open Specifications Documentation
Intellectual Property:
Copyright, Patents, Trademarks
License Programs:
Microsoft Open Specifications Promise; Microsoft Community Promise
Revision History Start Date:
12/5/2008
Latest Revision Date:
4/7/2021
Major Revisions:
0.1; 1.0; 2.0; 3.0; 4.0; 5.0
Support Contact:
[email protected]
Related Technologies:
Protocols, File Formats, Data Portability, Computer Languages, Standards Support
Title:
[MS-XOPP]: XML-binary Optimized Packaging (XOP) Profile
Document Type:
Technical Documentation
Specification Code:
MS-XOPP
Publisher:
Microsoft
Series:
Open Specifications
Subject:
XML-binary Optimized Packaging (XOP) profile and related protocol behavior
Scope:
Protocols, file formats, and standards support
Intellectual Property Notice:
Microsoft copyrights; no trade secret claims; patent rights subject to Open Specifications Promise or Community Promise
License Information:
Permission to copy and distribute for implementation purposes; patent licenses available via [email protected]
Support Contact:
[email protected]
Initial Release Date:
12/5/2008
Latest Revision Date:
6/25/2021
Current Version:
6.0
Revision History:
Major, Minor, Editorial, and None classifications documented from 2008 to 2021
Related Topics:
MIME Parts Ordering in Multipart/Related XOP Package Extension; Relationship to Other Protocols; Versioning and Capability Negotiation
Year:
2022
Event:
IMEKO 24th TC3, 14th TC5, 6th TC16 and 5th TC22 International Conference
Conference dates:
11–13 October 2022
Location:
Cavtat-Dubrovnik, Croatia
Authors:
K. Geva; H. Kahmann; C. Schlegel; R. Kumme
Affiliation:
Physikalisch-Technische Bundesanstalt (PTB), Braunschweig, Germany
Type of document:
Conference paper
Subject:
Stiffness measurement and calibration of hinge measurement flexures
Related equipment:
5 MN·m torque standard machine
Keywords:
stiffness measurement; multi-component measurement; hinge flexure; torque standard machine
Referenced methods:
finite element analysis; interferometric displacement measurement
Associated loads:
transversal force; bending moment; torque moment; axial force
Year:
2026
Region / City:
Kerala, India
Subject:
Digital Circuit Design, VLSI, Arithmetic Units
Document Type:
Research Brief / Technical Paper
Institution:
Viswajyothi College of Engineering & Technology, Department of ECE
Authors:
Ayana George, Cuckoo Anitha Joseph
Intended Audience:
VLSI designers, DSP system engineers, researchers in digital electronics
Methodology:
Logic optimization based on data dependence, use of BEC and conventional CSLA analysis
Performance Metrics:
Area–Delay Product (ADP), energy consumption
Application:
ASIC synthesis, square-root CSLA implementation
Technology Focus:
Low-power, area-efficient VLSI design, carry select adder