№ files_lp_3_process_7_064381
This paper discusses a novel process for fine-pitch face-to-back chip-on-wafer integration and its application in 3D heterogeneous systems.
Year: 2023
Region / city: N/A
Subject: Chip-on-Wafer integration, 3D heterogeneous systems, Cu–Cu hybrid bonding
Document Type: Research Paper
Organization / Institution: Sony
Author: A. Urata et al.
Target Audience: Researchers and professionals in semiconductor technologies
Period of Validity: N/A
Approval Date: N/A
Date of Changes: N/A
Price: 8 / 10 USD
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