№ lp_2_3_62636
Industry standardization meeting summary documenting company observations and proposals on AI/ML-based CSI compression, training collaboration types, and related specification impacts within 3GPP RAN1 discussions.
Organization: 3GPP TSG-RAN WG1
Meeting: Meeting #112bis-e
Document Number: R1-230xxxx
Agenda Item: 9.2.2.2
Date: April 17–26, 2023
Meeting Type: e-Meeting
Source: Moderator (Apple)
Moderator: Huaning Niu (Apple)
Contributing Companies: Apple; NTT DOCOMO; Qualcomm; NEC; CATT; LG Electronics; Spreadtrum; Lenovo; Samsung; CMCC; MediaTek; Panasonic; Xiaomi; Sony; Intel; AT&T; OPPO; Google; Huawei, HiSilicon; Fujitsu; CAICT; Futurewei; NVIDIA; InterDigital; ZTE; vivo
Topic: AI/ML for CSI enhancement
Technical Scope: CSI compression with two-sided model and training collaboration types
Document Type: Technical meeting summary
Price: 8 / 10 USD
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