№ files_lp_3_process_7_096777
Meeting summary of 3GPP RAN WG1 discussions outlining study objectives, company proposals, and evaluation methodology considerations for AI/ML-based CSI compression in the NR air interface under Rel-19.
Year: 2024
Meeting: 3GPP TSG RAN WG1 #116
Location: Athens, Greece
Dates: 26 Feb – 1 Mar 2024
Agenda item: 9.1.3.2
Source: Moderator (Qualcomm)
Title: Summary#2 for Additional Study on AI/ML for NR Air Interface: CSI Compression
Document for: Discussion and Decision
Related Work Item: Artificial Intelligence (AI)/Machine Learning (ML) for NR Air Interface (Rel-19)
Related Technical Report: TR 38.843
Topic: CSI compression using two-sided AI/ML model
Scope: Temporal, spatial, and frequency domain aspects of CSI compression
Companies involved: Qualcomm; Lenovo; New H3C; Samsung; Indian Institute of Technology Madras; Fujitsu; vivo; SK telecom; Mavenir; Panasonic; OPPO; NTT DOCOMO; ETRI; Ericsson; ZTE; IIT Kanpur; Spreadtrum; LG; CATT; Intel; Xiaomi; AT&T; CMCC; NVIDIA; MediaTek; Futurewei; TCL
Contact information included: Yes
Price: 8 / 10 USD
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