№ files_lp_4_process_3_124720
Year: 2026
Location: Gothenburg, Sweden
Subject: CSI compression using two-sided AI/ML model
Document type: Technical report
Organization: 3GPP TSG RAN WG1
Author: Moderator (Qualcomm)
Target audience: RAN1, RAN2, RAN3, RAN4 members, industry participants
Agenda item: 9.1.1
Date of meeting: February 9–13, 2026
Contact information: Multiple participating companies listed with emails
Proposals included: VQ vs. SQ performance, VQ-LUT configurations, payload optimization, quantization codebook exchange
Performance metrics: SGCS gain, throughput for different ranks and RU percentages
References: Rel-19 study, Rel-20 AI/ML-based CSI compression
Context: Technical report summarizing discussion and decisions on inference and other aspects of two-sided CSI compression, including company proposals, performance comparisons, and standardization considerations.
Price: 8 / 10 USD
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