№ files_lp_4_process_1_47177
Year: 2026
Location: Gothenborg, Sweden
Subject: CSI compression and AI/ML model specification for RAN
Document type: Meeting summary / Technical report
Organization: 3GPP TSG RAN WG1
Author: Moderator (Qualcomm)
Contributors: Qualcomm, OPPO, Lenovo, Ofinno, NTT DOCOMO, Sharp, CMCC, Ericsson, Futurewei, MediaTek, CEWiT, CATT, Panasonic, Samsung, LG Electronics, TCL, NEC, Apple, Vivo, InterDigital, ETRI, China Telecom, Fujitsu, Toyota, Nokia
Agenda item: 9.1.1
Target group: RAN1 and RAN2 technical experts
Related release: Rel-19 conclusions and Rel-20 AI/ML CSI compression work
Key topics: Spatial-frequency CSI compression, two-sided AI/ML model, quantization, payload configuration, inter-vendor collaboration, performance monitoring
Data collection: NW and UE side training data, dataset format and exchange specification
Decision points: Check-points in RAN#110, standardization of encoder model and dataset, performance evaluation metrics
Contact information: Provided for all participating companies
Context: Technical report summarizing proposals, observations, and specifications regarding two-sided AI/ML-based CSI compression for RAN1 and RAN2, including payload, quantization, and inter-vendor collaboration aspects.
Price: 8 / 10 USD
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