№ files_lp_4_process_2_41418
Technical meeting contribution summarizing company proposals, observations, and discussion points on modulation schemes and modulation-coding combinations considered in the development of the physical layer structure for 6GR within 3GPP RAN1.
Year: 2026
Meeting: 3GPP TSG RAN WG1 Meeting #124
Location: Gothenburg, Sweden
Agenda item: 10.3.2
Topic: Modulation, joint channel coding and modulation for 6GR
Document type: Meeting contribution / technical summary
Organization: 3GPP TSG RAN Working Group 1
Source: Moderator (Qualcomm Incorporated)
Author: Moderator (Qualcomm Incorporated)
Purpose: Discussion/Decision
Related release: Rel-20
Related technology: 6GR Physical Layer
Companies referenced: Nokia; Huawei; Oppo; CATT; CMCC; Xiaomi; vivo; NEC; Ericsson; Panasonic; DCM
Technical concepts: QAM modulation; MCS tables; spectral efficiency; CQI feedback; MPR; CP-OFDM; DFT-s-OFDM
Referenced specification: TS 38.214
Price: 8 / 10 USD
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