№ files_lp_3_process_9_36817
Meeting summary document outlining technical topics, company contributions, change requests, liaison statements, and open issues discussed under Rel-18 UE RF maintenance within 3GPP TSG-RAN WG4.
Organization: 3GPP TSG-RAN WG4
Meeting number: 113
Location: Orlando, US
Meeting dates: 18–22 November 2024
Agenda item: 5.1.1
Document number: R4-2418125
Source: Moderator (Huawei)
Title in document: Topic summary for [113][103] R18_UERF_maintenance_Part2
Release: Rel-18
Technical scope: TEI UE RF part
Related agenda items: AI 5.18, AI 5.19, AI 5.20, AI 5.32.1, AI 5.33.1
Work items: Multi-carrier enhancements for NR; Further NR coverage enhancements; NR sidelink evolution; FR2 power class 8
Companies involved: Huawei, HiSilicon, Qualcomm Incorporated, vivo, ZTE Corporation, Sanechips, Ericsson, Intel, LG Electronics, Telecom Italia, US Cellular, AT&T
Referenced specifications: TS 38.101-1, TS 38.101-2, TS 38.101-3, TS 38.307
Document type: Meeting agenda summary and contribution overview
Decision process: Collection of CRs and LS comments before NWM deadline (19 November 2024, 18:00 local time) with final decision made online
Price: 8 / 10 USD
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