№ files_lp_4_process_3_124752
Technical summary report on agreements, proposals, and discussions regarding AI/ML inter-vendor training collaboration, dataset exchange, parameter specification, and performance targets for NR air interface, based on RAN1 #124 meeting contributions.
Year: 2026
Location: Gothenburg, Sweden
Subject: AI/ML-based inter-vendor training collaboration for NR air interface
Document Type: Meeting summary / technical report
Organization: 3GPP TSG RAN WG1
Authors: Moderator (Apple), Huaning Niu; contributions from OPPO, Lenovo, NTT DOCOMO, Huawei, Ericsson, MediaTek, ZTE, CMCC, CATT, Panasonic, NEC, LG Electronics, Fujitsu, vivo, Samsung, Sony, InterDigital, ETRI, TCL, Xiaomi, IITM, Toyota, Ofinno, Spreadtrum, China Telecom, Futurewei
Agenda Item: 9.1.2
Reference: RP-253340, Revised WID: Artificial Intelligence (AI)/Machine Learning (ML) for NR air interface phase 2
Key Topics: Direction C reference model, Direction A sub-options 3a-1 and 4-1, standardized dataset and parameter exchange, performance metrics (SGCS/NMSE), RAN1 scalability study outcomes
Meeting Dates: Feb 9–13, 2026
Price: 8 / 10 USD
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