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Technical meeting summary documenting agreements and proposals discussed under agenda item 9.1.2 regarding standardized dataset and parameter exchange, CSI feedback association, and reference model specifications for AI/ML-based CSI compression in NR air interface phase 2.
Year: 2026
Meeting: 3GPP TSG RAN WG1 #124
Document Number: R1-2601149
Agenda Item: 9.1.2
Location: Gothenburg, Sweden
Date: Feb 9–13, 2026
Source: Moderator (Apple)
Title: FL summary # 1 for inter-vendor training collaboration
Document For: Discussion/Decision
Topic: Inter-vendor training collaboration for two-sided AI/ML models
Related Work Item: RP-253340 “Revised WID: Artificial Intelligence (AI)/Machine Learning (ML) for NR air interface phase 2”
Technical Scope: Direction C reference model; Direction A options 3a-1 and 4-1; standardized dataset format/content; encoder model structure; parameter and dataset exchange; CSI compression
Contributing Companies: Apple, OPPO, Lenovo, NTT DOCOMO, Huawei, HiSilicon, Ericsson, MediaTek, ZTE, CMCC, CATT, Panasonic, NEC, LG Electronics, Fujitsu, vivo, Samsung, Sony, InterDigital, ETRI, TCL, Xiaomi, IITM, Toyota
Contact Persons: Huaning Niu; Wendong Liu; Vahid Pourahmadi; Xin Wang; Keyvan Zarifi; Yuan Li; Jingya Li; Xinlin Zhang; Pedram Kheirkhah Sangdeh; Reubengeorge Stephen; Hanchao Liu; Wenfeng Liu; Yi Zheng; Yongchang Liu; Qianrui Li; Tetsuya Yamamoto; Hidetoshi Suzuki; Xuan Tuong Tran; Shafivulla Sayyed; Peng Guan; Zhen He; Minseok Jo; Xin Wang; Liqiang Jin; Yuanyuan Wang; Ameha Tsegaye Abebe; Chen Sun; Yingshuang Bai; Afshin Haghighat; Anseok Lee; Pu Yuan; Tianqi Wu; Mu Qin; Liu Zhengxuan; Liu Min; Anil Kumar Y; Sai Praneeth K; Konstantinos Dimou; Takayuki Shimizu
Performance Metrics: Average SGCS; Average NMSE; Optional NMSE and/or SGCS at X-percentiles
Open Issues: Pairing ID uniqueness; impact of additional dataset samples; quantization codebook exchange method; rank association; per-layer CSI payload size consistency
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FL summary #1 for inter-vendor training collaboration, RAN1 #124, Gothenburg, Sweden, 9–13 February 2026
Year: 2026
Location: Gothenburg, Sweden
Event: 3GPP TSG RAN WG1 #124
Dates: 9–13 February 2026
Agenda Item: 9.1.2
Document ID: R1-2601149
Title: FL summary #1 for inter-vendor training collaboration
Source: Moderator (Apple)
Moderator: Huaning Niu
Organization: 3GPP TSG RAN Working Group 1
Topic: Artificial Intelligence / Machine Learning for NR air interface
Subtopic: Inter-vendor training collaboration for two-sided AI/ML models
Technical Scope: AI/ML-based CSI compression, dataset exchange, model parameter exchange, encoder model structure specification
Related Work Item: Revised WID “Artificial Intelligence (AI)/Machine Learning (ML) for NR air interface phase 2” (RP-253340)
Participants: Apple, OPPO, Lenovo, NTT DOCOMO, Huawei, Ericsson, MediaTek, ZTE, CMCC, CATT, Panasonic, NEC, LG Electronics, Fujitsu, vivo, Samsung, Sony, InterDigital, ETRI, TCL, Xiaomi, IITM, Toyota
Document Type: Technical meeting contribution / summary for discussion and decision
Purpose: Summary of contributions and proposals discussed under agenda item 9.1.2 in RAN1 #124
Key Topics: dataset format and exchange, encoder model structure standardization, pairing ID mechanism, CSI feedback and target CSI association
Performance Metrics Mentioned: SGCS, NMSE
FL summary # 1 for inter-vendor training collaboration
Year: 2026
Region / city: Gothenburg, Sweden
Topic: Artificial Intelligence (AI) / Machine Learning (ML) for NR air interface
Document Type: Technical Report
Organization: 3GPP TSG RAN WG1
Author: Moderator (Apple)
Target Audience: Industry professionals and organizations in telecommunications
Effective Period: 2026-02-09 to 2026-02-13
Approval Date: February 9th, 2026
Last Modified: February 13th, 2026
FL summary #1 for inter-vendor training collaboration, 3GPP TSG RAN WG1 #124, Gothenburg, Sweden, 9–13 February 2026
Year: 2026
Location: Gothenburg, Sweden
Organization: 3GPP TSG RAN WG1
Meeting: RAN WG1 #124
Agenda Item: 9.1.2
Document ID: R1-2601149
Title Reference: FL summary #1 for inter-vendor training collaboration
Source: Moderator (Apple)
Primary Contact: Huaning Niu
Companies Involved: Apple, OPPO, Lenovo, NTT DOCOMO, Huawei, HiSilicon, Ericsson, MediaTek, ZTE, China Mobile, CATT, Panasonic, NEC, LG Electronics, Fujitsu, vivo, Samsung, Sony, InterDigital, ETRI, TCL, Xiaomi, IITM, Toyota, Ofinno, Spreadtrum
Technical Domain: AI/ML for NR air interface
Subject: Inter-vendor training collaboration for AI/ML-based CSI compression
Related Work Item: Artificial Intelligence (AI)/Machine Learning (ML) for NR air interface phase 2 (RP-253340)
Document Type: Technical meeting contribution summary
Purpose: Discussion and decision
Technical Scope: Dataset exchange, encoder model structure, model parameter exchange, CSI feedback and target CSI association
Participants: Multiple telecommunications vendors and research organizations
Contact Information Included: Yes
FL summary # 1 for inter-vendor training collaboration
Year: 2026
Region / City: Gothenburg, Sweden
Topic: Artificial Intelligence (AI) / Machine Learning (ML)
Document Type: Meeting Document
Organization / Institution: 3GPP TSG RAN WG1
Author: Moderator (Apple), Huaning Niu, et al.
Target Audience: 3GPP TSG RAN WG1 members, vendors
Period of Validity: 2026
Approval Date: February 2026
Date of Changes: N/A
Contact Information: [email protected], [email protected], etc.
Summary: The document summarizes proposals and contributions regarding inter-vendor AI/ML-based training collaboration within the context of the 3GPP RAN1 #124 meeting.
INTER-VENDOR DISCORDANCE OF FETAL AND NEONATAL MYOCARDIAL TISSUE DOPPLER AND SPECKLE TRACKING MEASUREMENTS
Year: 2015
Region / City: London, UK
Topic: Fetal and neonatal echocardiography
Document Type: Research Article
Authors: Dr. Olga Patey, Professor Julene S. Carvalho, Professor Basky Thilaganathan
Target Audience: Medical professionals, researchers
Period of Study: 2012–2015
Approval Date: 2012
Modification Date: Not specified
Keywords: fetal heart, fetal echocardiography, myocardial deformation, neonatal echocardiography, speckle tracking, tissue Doppler imaging, repeatability, reproducibility
Context Description: The document evaluates the inter-vendor reproducibility and observer repeatability of TDI and STE measurements in normal term fetuses and neonates, emphasizing the challenges in comparing echocardiographic findings across different ultrasound systems.
FL summary # 1 for inter-vendor training collaboration
Year: 2026
Region / City: Gothenburg, Sweden
Topic: AI/ML Inter-vendor Collaboration
Document Type: Report
Organization: 3GPP
Author: Moderator (Apple), Huaning Niu
Target Audience: Industry professionals in AI/ML and 3GPP members
Action Period: February 9th - 13th, 2026
Approval Date: Not specified
Date of Changes: Not specified
Note: Summary
FL summary # 1 for inter-vendor training collaboration
Year: 2026
Region / City: Gothenburg, Sweden
Theme: AI/ML in NR air interface
Document Type: Discussion/Decision
Organization / Institution: 3GPP TSG RAN WG1
Author: Huaning Niu (Apple), Wendong Liu (OPPO), Vahid Pourahmadi (Lenovo), Xin Wang (NTT DOCOMO), Keyvan Zarifi (Huawei), et al.
Target Audience: Industry professionals in wireless communications and AI/ML
Period of Application: 2026
Approval Date: February 9th – 13th, 2026
Date of Changes: Not specified
FL summary # 1 for inter-vendor training collaboration
Year: 2026
Region / City: Gothenburg, Sweden
Topic: Inter-vendor AI/ML training collaboration
Document Type: Meeting Summary
Organization: 3GPP TSG RAN WG1
Author: Moderator (Apple)
Target Audience: 3GPP Members
Period of Validity: February 9th – 13th, 2026
Approval Date: N/A
Modification Date: N/A
FL summary #1 for inter-vendor training collaboration at RAN1 #124, Gothenburg, Feb 2026
Year: 2026
Location: Gothenburg, Sweden
Subject: AI/ML-based inter-vendor training collaboration for NR air interface
Document Type: Meeting summary / technical report
Organization: 3GPP TSG RAN WG1
Authors: Moderator (Apple), Huaning Niu; contributions from OPPO, Lenovo, NTT DOCOMO, Huawei, Ericsson, MediaTek, ZTE, CMCC, CATT, Panasonic, NEC, LG Electronics, Fujitsu, vivo, Samsung, Sony, InterDigital, ETRI, TCL, Xiaomi, IITM, Toyota, Ofinno, Spreadtrum, China Telecom, Futurewei
Agenda Item: 9.1.2
Reference: RP-253340, Revised WID: Artificial Intelligence (AI)/Machine Learning (ML) for NR air interface phase 2
Key Topics: Direction C reference model, Direction A sub-options 3a-1 and 4-1, standardized dataset and parameter exchange, performance metrics (SGCS/NMSE), RAN1 scalability study outcomes
Meeting Dates: Feb 9–13, 2026
Contact Emails: [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected], [email protected]
FL summary #1 for inter-vendor training collaboration at RAN1 #124, Gothenburg, Feb 2026
Year: 2026
Location: Gothenburg, Sweden
Subject: AI/ML inter-vendor training collaboration for NR air interface
Document type: Meeting report / Summary
Organization: 3GPP TSG RAN WG1
Authors: Huaning Niu (Apple), Wendong Liu (OPPO), Vahid Pourahmadi (Lenovo), Xin Wang (NTT DOCOMO), Keyvan Zarifi & Yuan Li (Huawei, HiSilicon), Jingya Li & Xinlin Zhang (Ericsson), Pedram Kheirkhah Sangdeh & Reubengeorge Stephen (MediaTek), Hanchao Liu & Wenfeng Liu (ZTE), Yi Zheng & Yongchang Liu (CMCC), Qianrui Li (CATT), Tetsuya Yamamoto, Hidetoshi Suzuki & Xuan Tuong Tran (Panasonic), Shafivulla Sayyed, Peng Guan & Zhen He (NEC), Minseok Jo (LG Electronics), Xin Wang & Liqiang Jin (Fujitsu), Yuanyuan Wang (vivo), Ameha Tsegaye Abebe (Samsung), Chen Sun & Yingshuang Bai (Sony), Afshin Haghighat (InterDigital), Anseok Lee (ETRI), Pu Yuan & Tianqi Wu (TCL), Mu Qin, Liu Zhengxuan & Liu Min (Xiaomi), Anil Kumar Y & Sai Praneeth K (IITM), Konstantinos Dimou & Takayuki Shimizu (Toyota), Jaehoon Chung (Ofinno), Zhe Yu (Spreadtrum), Nanxi Li & Yueyan Chu (China Telecom), Baoling Sheen (Futurewei)
Agenda item: 9.1.2
Period: Feb 9–13, 2026
Source: Moderator (Apple)
Status: Discussion/Decision
Focus: Specification of standardized dataset format/content, parameter exchange, RAN1 scalability, AI/ML CSI compression models
FL summary #1 for inter-vendor training collaboration, Gothenburg, Sweden, Feb 2026
Year: 2026
Location: Gothenburg, Sweden
Subject: AI/ML-based NR air interface inter-vendor training
Document type: Meeting summary / Technical contribution
Organization: 3GPP TSG RAN WG1
Author: Moderator (Apple), Huaning Niu
Participants: Apple, OPPO, Lenovo, NTT DOCOMO, Huawei, Ericsson, MediaTek, ZTE, CMCC, CATT, Panasonic, NEC, LG Electronics, Fujitsu, vivo, Samsung, Sony, InterDigital, ETRI, TCL, Xiaomi, IITM, Toyota, Ofinno, Spreadtrum, China Telecom, Futurewei
Agenda item: 9.1.2
Period: Feb 9–13, 2026
Topics covered: Standardized dataset format, model parameter exchange, Direction A 3a-1 and 4-1, Direction C reference model, RAN1 scalability study outcomes, inter-vendor AI/ML collaboration agreements
Contact emails: Provided for all participating companies
FL summary # 1 for inter-vendor training collaboration
Year: 2026
Region / City: Gothenburg, Sweden
Topic: Inter-vendor training collaboration in AI/ML models for NR air interface
Document Type: Meeting Agenda
Organization / Institution: 3GPP TSG RAN WG1
Author: Moderator (Apple), Huaning Niu
Target Audience: 3GPP participants, RAN1, RAN4 experts
Period of Validity: February 9th – 13th, 2026
Approval Date: February 9th, 2026
Date of Changes: N/A
Enclosure to the application for Swedish Institute Scholarships for master level studies in Sweden starting the academic year 2026/2027
Year: 2026/2027
Region / City: Sweden
Topic: Swedish Institute Scholarships
Document Type: Reference Letter
Organization / Institution: Swedish Institute
Author: Swedish Institute
Target Audience: Scholarship Applicants
Period of Validity: Not specified
Approval Date: Not specified
Modification Date: Not specified
Enclosure to the application for Swedish Institute Scholarships for master’s level studies in Sweden starting in the academic year 2026/2027PROOF OF WORK AND LEADERSHIP EXPERIENCE (Instructions)
Year: 2026/2027
Region / City: Sweden
Subject: Swedish Institute Scholarships, Work and Leadership Experience
Document Type: Instructional Guide
Organization / Institution: Swedish Institute
Author: Swedish Institute
Target Audience: Scholarship applicants for master’s level studies in Sweden
Effective Period: Academic year 2026/2027
Approval Date: Not specified
Date of Amendments: Not specified
Annex 9OSPAR Convention for the Protection of the Marine Environment of the North-East Atlantic - Meeting of the Biodiversity Committee (BDC) - Varberg (Sweden): 24-28 February 2025 Terms of Reference for the Intersessional Correspondence Group on Marine Protected Areas (ICG-MPA) in 2025/2026
Year: 2025
Region / City: Varberg, Sweden
Topic: Marine Protected Areas, Biodiversity, Environmental Protection
Document Type: Terms of Reference
Organization: OSPAR Convention
Author: Germany (Janos Hennicke, German Federal Agency for Nature Conservation (BfN))
Target Audience: OSPAR Contracting Parties, Observers, Scientific Community
Period of Activity: 2025-2026
Approval Date: N/A
Date of Changes: N/A
Note: Context
Enclosure to the application for Swedish Institute Scholarships for Global Professionals for master level studies in Sweden starting the academic year 2025/2026. LETTER OF REFERENCE FORM (Instructions)
Year: 2025/2026
Region / City: Sweden
Theme: Scholarships, Higher Education
Document Type: Instructional Form
Organization / Institution: Swedish Institute
Author: Swedish Institute
Target Audience: Scholarship applicants
Period of validity: Until submission of scholarship application
Approval Date: Not specified
Date of Changes: Not specified
Enclosure to the application for Swedish Institute Scholarships for Global Professionals for master’s level studies in Sweden starting in the academic year 2025/2026 PROOF OF WORK AND LEADERSHIP EXPERIENCE (Instructions)
Year: 2025/2026
Region / City: Sweden
Theme: Scholarship application, work experience, leadership experience
Document type: Instructional form
Organization / Institution: Swedish Institute
Author: Swedish Institute
Target Audience: Applicants for the Swedish Institute Scholarships for Global Professionals
Period of validity: Academic year 2025/2026
Approval Date: Not specified
Modification Date: Not specified
Enclosure to the application for Swedish Institute Scholarships for Global Professionals for master’s level studies in Sweden starting academic year 2025/2026CURRICULUM VITAE TEMPLATE (Instructions)
Year: 2025/2026
Region / City: Sweden
Topic: Scholarship Application
Document Type: Instructions
Organization / Institution: Swedish Institute
Author: Swedish Institute
Target Audience: Applicants for the Swedish Institute Scholarships for Global Professionals
Period of Validity: Until the application deadline for the academic year 2025/2026
Approval Date: Not specified
Date of Changes: Not specified
Enclosure to the application for Swedish Institute Scholarships for Global Professionals for master’s level studies in Sweden starting academic year 2024/2025CURRICULUM VITAE TEMPLATE (Instructions)
Year: 2024/2025
Region / City: Sweden
Subject: Scholarship Application
Document Type: Application Instruction
Organ / Institution: Swedish Institute
Author: Swedish Institute
Target Audience: Applicants for Swedish Institute Scholarships for Global Professionals
Period of Validity: Academic year 2024/2025
Approval Date: Not specified
Modification Date: Not specified
Enclosure to the application for Swedish Institute Scholarships for Global Professionals for master level studies in Sweden starting the academic year 2024/2025
Year: 2024/2025
Region / city: Sweden
Subject: Scholarships
Document Type: Reference Letter
Organization / Institution: Swedish Institute
Author: Swedish Institute
Target Audience: Scholarship applicants
Validity Period: From academic year 2024/2025
Approval Date: Not provided
Date of Changes: Not provided
Topics: inter-vendor Sweden 124