№ files_lp_3_process_9_36713
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Feature lead summary of the R2D aspects and related procedures discussed for Device 2b and Device C in 3GPP R20 AIoT, covering proposals, evaluations, and agreements for M value changes and other technical aspects.
Year:
2025
Region / City:
Dallas, USA
Topic:
R2D Aspects for Device 2b/C
Document Type:
Feature Lead Summary
Organization:
3GPP TSG RAN WG1
Author:
Moderator (vivo)
Target Audience:
Industry professionals in telecommunications
Period of validity:
November 17th – 21st, 2025
Approval Date:
Not specified
Date of Changes:
Not specified
Note:
Context
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Year:
2026
City:
Gothenburg
Country:
Sweden
Event:
3GPP TSG RAN WG1 #124 Meeting
Agenda Item:
9.3.2.1
Topic:
R2D Aspects for Device 2b/C in Release 20 AIoT
Document Type:
Technical meeting contribution / feature lead summary
Standardization Body:
3GPP TSG RAN WG1
Source:
Moderator (vivo)
Working Group:
RAN1
Related Technical Report:
TR 38.769
Release:
Release 20
Discussion Scope:
R2D channel design, waveform parameters, and M value configuration
Referenced Companies:
Ericsson, Nokia, Qualcomm, Samsung, Xiaomi, Huawei, ZTE, OPPO, Panasonic, Apple, TCL, CATT, CMCC, Sequans, NTT DOCOMO, vivo
Subject Elements:
Mchipsymb parameter values, coverage performance analysis, BLER performance considerations, waveform and modulation aspects
Document Purpose:
Discussion and decision within the working group meeting
Document Structure:
Feature lead notes, background agreements, issue discussions, and text proposals for updates to TR 38.769
Year:
2026
Region / City:
Gothenburg, SE
Topic:
R2D Aspects for Device 2b/C in R20 AIoT
Document Type:
Meeting Document
Organization:
3GPP TSG RAN WG1
Author:
Moderator (vivo)
Target Audience:
Industry Professionals
Period of Validity:
February 09th – 13th, 2026
Approval Date:
February 2026
Modification Date:
N/A
Year:
2026
City:
Gothenburg
Country:
Sweden
Event:
3GPP TSG RAN WG1 #124 Meeting
Agenda Item:
9.3.2.1
Topic:
R2D Aspects for Device 2b/C in Release 20 AIoT
Document Type:
Technical meeting contribution / feature lead summary
Standardization Body:
3GPP TSG RAN WG1
Source:
Moderator (vivo)
Working Group:
RAN1
Related Technical Report:
TR 38.769
Release:
Release 20
Discussion Scope:
R2D channel design, waveform parameters, and M value configuration
Referenced Companies:
Ericsson, Nokia, Qualcomm, Samsung, Xiaomi, Huawei, ZTE, OPPO, Panasonic, Apple, TCL, CATT, CMCC, Sequans, NTT DOCOMO, vivo
Subject Elements:
Mchipsymb parameter values, coverage performance analysis, BLER performance considerations, waveform and modulation aspects
Document Purpose:
Discussion and decision within the working group meeting
Document Structure:
Feature lead notes, background agreements, issue discussions, and text proposals for updates to TR 38.769
Year:
2026
Region / City:
Gothenburg, SE
Topic:
R2D Aspects for Device 2b/C in R20 AIoT
Document Type:
Meeting Document
Organization:
3GPP TSG RAN WG1
Author:
Moderator (vivo)
Target Audience:
Industry Professionals
Period of Validity:
February 09th – 13th, 2026
Approval Date:
February 2026
Modification Date:
N/A
Year:
2020
Region / City:
Anantapur, Andhra Pradesh, India
Field:
Education, Technology
Document Type:
Course Structure
Institution:
Jawaharlal Nehru Technological University Anantapur
Author:
Jawaharlal Nehru Technological University Anantapur
Target Audience:
Students of B.Tech - AI & DS program
Period of validity:
Academic year 2020-2021
Approval Date:
Not specified
Date of revisions:
Not specified
Year:
2020
Region / City:
Anantapur
Subject:
Computer Science & Engineering
Document Type:
Course Structure
Institution:
Jawaharlal Nehru Technological University Anantapur
Author:
Not specified
Target Audience:
Students enrolled in the B.Tech program
Period of Validity:
Ongoing
Approval Date:
Not specified
Modification Date:
Not specified
Year:
2020
Region / city:
Anantapur, Andhra Pradesh
Field:
Education
Document Type:
Academic Course Structure
Institution:
Jawaharlal Nehru Technological University Anantapur
Author:
N/A
Target Audience:
Students of B.Tech Mechanical Engineering
Period of Effectiveness:
2020-2024
Approval Date:
N/A
Date of Changes:
N/A
Year:
2026
City:
Gothenburg
Country:
Sweden
Event:
3GPP TSG RAN WG1 #124 Meeting
Agenda Item:
9.3.2.1
Topic:
R2D Aspects for Device 2b/C in Release 20 AIoT
Document Type:
Technical meeting contribution / feature lead summary
Standardization Body:
3GPP TSG RAN WG1
Source:
Moderator (vivo)
Working Group:
RAN1
Related Technical Report:
TR 38.769
Release:
Release 20
Discussion Scope:
R2D channel design, waveform parameters, and M value configuration
Referenced Companies:
Ericsson, Nokia, Qualcomm, Samsung, Xiaomi, Huawei, ZTE, OPPO, Panasonic, Apple, TCL, CATT, CMCC, Sequans, NTT DOCOMO, vivo
Subject Elements:
Mchipsymb parameter values, coverage performance analysis, BLER performance considerations, waveform and modulation aspects
Document Purpose:
Discussion and decision within the working group meeting
Document Structure:
Feature lead notes, background agreements, issue discussions, and text proposals for updates to TR 38.769
Year:
2026
Location:
Göteborg, Sweden
Organization:
3GPP TSG-RAN WG4
Document type:
Meeting summary / Technical report
Topic:
AI/ML-based CSI compression, dataset and model development, inter-vendor interoperability
Contributors:
Ericsson, Xiaomi, Apple, CMCC, Oppo, Huawei, Nokia, LG Electronics, NTU
Agenda item:
7.9.1
Target audience:
RAN4 members, technical experts in 3GPP standards
Date of meeting:
9–13 February 2026
Document purpose:
Information and discussion of proposals and observations on AI/ML-based CSI compression
Related releases:
Rel-19, Rel-20
Standards referenced:
38.101-1, 38.214
Technical focus:
Test decoders, reference encoders, dataset alignment, model generalization, LCM requirements
Year:
2026
Region / City:
Gothenburg, SE
Topic:
R2D Aspects for Device 2b/C in R20 AIoT
Document Type:
Meeting Document
Organization:
3GPP TSG RAN WG1
Author:
Moderator (vivo)
Target Audience:
Industry Professionals
Period of Validity:
February 09th – 13th, 2026
Approval Date:
February 2026
Modification Date:
N/A
Year:
2026
Location:
Gothenburg, Sweden
Meeting:
TSG-RAN WG2 #133
Topics:
NR Mobility Enhancements, Network Energy Saving, AI/ML Mobility
Document Type:
Meeting Report
Source:
Vice Chairman (Samsung)
Participants:
MediaTek Inc., ZTE Corporation, Ericsson, Qualcomm Incorporated, Samsung, CATT, OPPO, Xiaomi, Huawei, HiSilicon, Apple, vivo
Releases Covered:
Rel-18, Rel-19, Rel-20
Standards References:
TS 38.300, TS 38.306, TS 38.321, TS 38.331, TS 38.101-1, TS 38.101-5, TS 38.213, TS 38.133
Agenda Items:
9.1, 8.5
Target Audience:
3GPP members and contributors
Status:
For Approval
Endorsed Proposals:
LS replies, CRs, Stage-2 corrections, discussion items
Year:
2026
Region / city:
Gothenburg, Sweden
Subject:
NR mobility enhancements, energy saving, and network specifications
Document type:
Report
Organization / institution:
3GPP TSG-RAN WG2
Author:
Vice Chairman (Samsung)
Target audience:
Technical experts in wireless communication
Validity period:
February 9th – 13th, 2026
Approval date:
Not specified
Modification date:
Not specified