№ files_lp_4_process_3_133643
Year: 2026
Region / City: Berlin, Germany; Colorado, USA
Topic: Power Electronics Materials Reliability
Document Type: Research Article
Institution: National Renewable Energy Laboratory; CuNex GmbH; budatec GmbH
Authors: Paul Paret, Sri Krishna Bhogaraju, Sreekant Narumanchi
Material Studied: Sintered Copper (Cuprum 80)
Application: Die-attach and substrate-attach in high-temperature power modules
Experimental Conditions: Thermal shock cycling between -40°C and 200°C, up to 1000 cycles
Methods: C-SAM imaging, crack growth analysis, sintering under inert atmosphere
Sample Configuration: Cu baseplates 3–5 mm thick, grid and stripe stencil patterns, active-metal-brazed substrate
Focus: Thermomechanical degradation and failure mechanisms of sintered copper bonds
Price: 8 / 10 USD
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