№ files_lp_4_process_3_124680
Technical meeting contribution summarizing company comments and proposals regarding the structure of a technical report for the Release 18 study on artificial intelligence and machine learning for the NR air interface within the 3GPP RAN WG1 work program.
Year: 2022
Event: 3GPP TSG RAN WG1 #109-e Meeting
Date: May 9–20, 2022
Agenda item: 9.2
Organization: 3GPP TSG RAN Working Group 1
Source: Qualcomm Incorporated
Document type: Technical meeting contribution
Subject: AI/ML for NR air interface
Study item: Release 18 Study Item on AI/ML for NR air interface
Participating companies: Qualcomm Incorporated; NVIDIA; Apple; Panasonic; ZTE; vivo; LG; Lenovo
Key topics: TR skeleton structure; evaluation methodology; use cases for CSI feedback enhancement, beam management, and positioning accuracy enhancements; specification impact assessment
Intended audience: 3GPP RAN WG1 participants and contributors
Reference context: Study approved at RAN #94
Price: 8 / 10 USD
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