№ lp_1_2_42108
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A technical report detailing discussions and agreements on UE capability signalling for further mobility enhancements in NR (New Radio) networks, with contributions from multiple companies, presented during a 3GPP meeting.
Year: 2024
Region / City: Athens, Greece
Topic: UE capability signalling for feMob
Document Type: Report
Organization / Institution: Intel Corporation
Author: Intel Corporation
Target Audience: Companies involved in the discussion of UE capabilities
Period of validity: February 2024
Approval Date: Not specified
Amendment Date: Not specified
Note: Context
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Report of [Post124][561][feMob] UE capability (Intel)
Year: 2024
Region / city: Athens, Greece
Topic: UE capabilities for NR mobility enhancements
Document Type: Report
Organization / institution: Intel Corporation
Author: Intel Corporation
Target audience: 3GPP participants
Period of validity: 2024
Approval date: Not specified
Amendment date: Not specified
Report of [Post124][561][feMob] UE capability (Intel)
Year: 2024
Region / city: Athens, Greece
Topic: UE capability for feMob
Document Type: Meeting Report
Organization: 3GPP TSG RAN WG2
Author: Intel Corporation
Target Audience: 3GPP participants, telecom industry professionals
Period of validity: Phase 1 comments due by 26th January 2024, Phase 2 deadline by 9th February 2024
Approval Date: N/A
Amendment Date: N/A
Report of [Post124][561][feMob] UE capability (Intel)
Year: 2024
Region / City: Athens, Greece
Topic: Mobile networks, UE capability signalling
Document type: Meeting Report
Organ / Institution: 3GPP TSG RAN WG2
Author: Intel Corporation
Target audience: Industry stakeholders in mobile telecommunications
Period of validity: February - March 2024
Approval date: N/A
Date of changes: N/A
Report of [Post124][561][feMob] UE capability (Intel)
Year: 2024
Region / city: Athens, Greece
Topic: UE capability for feMob
Document type: Report
Organ / institution: 3GPP TSG RAN WG2
Author: Intel Corporation
Target audience: Telecommunications professionals
Effective period: 26th Feb – 1st Mar, 2024
Approval date: 26th Jan, 2024
Amendment date: 9th Feb, 2024
Note: Context description
Report of [Post124][561][feMob] UE capability (Intel)
Year: 2024
Region / city: Athens, Greece
Theme: UE capability signaling for further mobility enhancements
Document type: Report
Organization: 3GPP TSG RAN WG2
Author: Intel Corporation
Target audience: 3GPP RAN members
Period of validity: Until February 2024
Approval date: N/A
Date of changes: N/A
Scope: Discussion on UE capabilities for further mobility enhancements
Deadline: 26th January 2024 (Phase 1), 9th February 2024 (Phase 2)
Note: Company contacts
MediaTek: Li-Chuan TSENG, [email protected]
Xiaomi: Yumin Wu, [email protected]
Apple: Naveen Palle, [email protected]
Ericsson: Antonino Orsino, [email protected]
Nokia: Endrit Dosti, [email protected]
Context: A technical report discussing UE capabilities and signaling for mobility enhancements in 5G NR, focusing on RAN1 and RAN2 features related to LTM.
Report of [Post124][561][feMob] UE capability (Intel) discussed at 3GPP TSG RAN WG2 Meeting #125, Athens, Greece, 26 Feb – 1 Mar 2024
Year: 2024
Location: Athens, Greece
Organization: 3GPP TSG RAN WG2
Author: Intel Corporation
Contributors: MediaTek, Xiaomi, Apple, Nokia, Ericsson
Document type: Meeting report
Agenda item: 7.4.1
Release: Rel-18
Scope: Discussion on UE capabilities for further mobility enhancements
Deadlines: Phase 1 – 26 January 2024, Phase 2 – 9 February 2024
Contact persons: Li-Chuan TSENG (MediaTek), Yumin Wu (Xiaomi), Naveen Palle (Apple)
Report of [Post124][561][feMob] UE capability (Intel)
Year: 2024
Region / city: Athens, Greece
Topic: UE capabilities for NR mobility enhancements
Document Type: Report
Organization / institution: Intel Corporation
Author: Intel Corporation
Target audience: 3GPP participants
Period of validity: 2024
Approval date: Not specified
Amendment date: Not specified
Report of [Post124][561][feMob] UE capability (Intel)
Year: 2024
Region / city: Athens, Greece
Topic: UE capability for feMob
Document Type: Meeting Report
Organization: 3GPP TSG RAN WG2
Author: Intel Corporation
Target Audience: 3GPP participants, telecom industry professionals
Period of validity: Phase 1 comments due by 26th January 2024, Phase 2 deadline by 9th February 2024
Approval Date: N/A
Amendment Date: N/A
Report of [Post124][561][feMob] UE capability (Intel)
Year: 2024
Region / City: Athens, Greece
Topic: Mobile networks, UE capability signalling
Document type: Meeting Report
Organ / Institution: 3GPP TSG RAN WG2
Author: Intel Corporation
Target audience: Industry stakeholders in mobile telecommunications
Period of validity: February - March 2024
Approval date: N/A
Date of changes: N/A
Report of [Post124][561][feMob] UE capability (Intel)
Year: 2024
Region / city: Athens, Greece
Topic: UE capability for feMob
Document type: Report
Organ / institution: 3GPP TSG RAN WG2
Author: Intel Corporation
Target audience: Telecommunications professionals
Effective period: 26th Feb – 1st Mar, 2024
Approval date: 26th Jan, 2024
Amendment date: 9th Feb, 2024
Note: Context description
Report of [Post124][561][feMob] UE capability (Intel)
Year: 2024
Region / city: Athens, Greece
Theme: UE capability signaling for further mobility enhancements
Document type: Report
Organization: 3GPP TSG RAN WG2
Author: Intel Corporation
Target audience: 3GPP RAN members
Period of validity: Until February 2024
Approval date: N/A
Date of changes: N/A
Scope: Discussion on UE capabilities for further mobility enhancements
Deadline: 26th January 2024 (Phase 1), 9th February 2024 (Phase 2)
Note: Company contacts
MediaTek: Li-Chuan TSENG, [email protected]
Xiaomi: Yumin Wu, [email protected]
Apple: Naveen Palle, [email protected]
Ericsson: Antonino Orsino, [email protected]
Nokia: Endrit Dosti, [email protected]
Context: A technical report discussing UE capabilities and signaling for mobility enhancements in 5G NR, focusing on RAN1 and RAN2 features related to LTM.
Report of [Post124][561][feMob] UE capability (Intel) discussed at 3GPP TSG RAN WG2 Meeting #125, Athens, Greece, 26 Feb – 1 Mar 2024
Year: 2024
Location: Athens, Greece
Organization: 3GPP TSG RAN WG2
Author: Intel Corporation
Contributors: MediaTek, Xiaomi, Apple, Nokia, Ericsson
Document type: Meeting report
Agenda item: 7.4.1
Release: Rel-18
Scope: Discussion on UE capabilities for further mobility enhancements
Deadlines: Phase 1 – 26 January 2024, Phase 2 – 9 February 2024
Contact persons: Li-Chuan TSENG (MediaTek), Yumin Wu (Xiaomi), Naveen Palle (Apple)
Intel® graphics virtualization update
Year: 2026
Region / city: Worldwide
Topic: Graphics Virtualization, IT Solutions
Document type: Technical Report
Organization: Intel Corporation
Author: Sunil Jain
Target audience: IT professionals, developers, open source contributors
Action period: Ongoing
Approval date: Not specified
Modification date: Not specified
Intel Drop #42 – Civil War, Epstein's CSRQ Account, Davos Intel (January–February 2024)
Author: We Are Sovereign (@OculumLabs)
Contributors: Bill; Gideon; Michael
Date of publication: January 26, 2024
Date of edit: February 25, 2024
Type of document: Online political commentary and interview transcript
Platform: CBDCIntel.org; Twitter; Telegram
Thematic focus: U.S. political crisis; Texas–Federal Government confrontation; World Economic Forum Davos 2024; CSRQ and USDR; Jeffrey Epstein
Referenced individuals: Joe Biden; Donald Trump; Jeffrey Epstein
Geographical focus: United States; Texas; Davos
Format: Edited conversational transcript
Hennepin County Department of Community Corrections and Rehabilitation (DOCCR) Intel Network
Note: Year
Contextual Description: A contact list for law enforcement and correctional personnel involved in public safety intelligence sharing in Hennepin County.
Intel Network Builders Enterprise Networks Insights Series Webinar: Why Edge & AI
Organization: Intel Corporation
Partner Organization: HCL Technologies
Event Series: Intel Network Builders Enterprise Networks Insights Series
Webinar Title: Why Edge & AI
Format: Online webinar presentation and discussion
Platform: BrightTALK
Corporate Participants: Shawn Sweeney; Shane Engle; Renu Navale
Roles: Business Development Manager; Executive Go-to-Market Expert; Vice President, Data Platforms Group and General Manager, Edge Computing and Ecosystem Enabling Division
Topic: Edge computing, artificial intelligence, cloud computing, 5G, network transformation
Industry Focus: Enterprise IT, telecommunications, IoT, network infrastructure
Audience: Enterprise networks professionals, IT leaders, telecom operators, industry partners
Referenced Organizations: Gartner
Referenced Technologies: AI; 5G; NFV; Edge to Cloud solutions; autonomous driving technologies
Geographic Scope: Global
Promotional Voice-over Theme: Innovation, multi-architecture computing, AI democratization, edge deployment, network evolution
Recording Context: Live monthly webinar series with audience Q&A and supplementary materials
Report of email discussion [AT117-e][116][NTN] Measurement gaps (Intel)
Year: 2022
Region / City: Global
Topic: Measurement gaps for NTN
Document type: Report
Organization / Institution: Intel Corporation
Author: Intel Corporation
Target Audience: Industry professionals, engineers, and organizations working on NTN and 5G networks
Period of validity: N/A
Approval date: N/A
Date of amendments: N/A
Configuration and Programming Notes for Hosting a Webpage on Intel Edison Using Arduino IDE 1.6.5
Year: Not specified
Platform: Intel Edison
Development Environment: Arduino IDE 1.6.5
Programming Language: Arduino (C/C++ based)
Network Configuration: Custom HTTP port 1000
Referenced Examples: WiFiWebServer Arduino example
Hardware Inputs: Digital pins 2, 4, 6, 8
Primary Functionality: Webpage hosting with background computations
Port Restrictions: Avoid ports 22, 23, 80, 443
Update Mechanism: Polling (with suggested interrupt-based improvement)
Type of Document: Technical implementation notes
HS104 Network Security Application Platform with Intel LGA1151 6th/7th Gen Processor and Quad-Port MGT
Year: 2022
Manufacturer: Shenzhen Lianrui Electronics Co., Ltd
Model: HS104
Processor: Intel LGA1151 6th/7th Gen Celeron/Pentium/Core i3/i5/i7/Xeon E3-1200 V5
Memory: Up to 64GB DDR4 2133MHz DIMM
Expansion Slots: 4 x PCIe
Storage Interfaces: 2 x SATA3.0, 1 x CF Interface
Power Supply: 250W single AC
Form Factor: 2.1U 19" rack-mounted
Operating Temperature: 0℃~50℃
Storage Temperature: -20℃~75℃
Connectivity: 4 electrical ports, 4 optical ports, 8 electrical ports, 8 optical ports, 20 Gigabit module card
Intended Use: Industrial automation, communication, transportation, education, medical sectors
Documentation Version: Product Brief v1.0
Support: http://www.lr-link.com/support
Report of [AT119bis-e][117][NR NTN Enh] Cell Reselection Enhancements (Intel), 3GPP TSG-RAN WG2 Meeting #119bis-e, Oct 10–19, 2022
Year: 2022
Event: 3GPP TSG-RAN WG2 Meeting #119bis-e
Date: Oct 10–19, 2022
Agenda item: 8.7.4
Organization: 3rd Generation Partnership Project (3GPP)
Working group: TSG-RAN WG2
Source: Intel Corporation
Document identifier: R2-2210860
Document type: Technical meeting contribution / discussion report
Topic: NR NTN cell reselection enhancements
Technology domain: 5G NR Non-Terrestrial Networks (NTN)
Purpose: Discussion and decision
Scope: NTN-NTN and NTN-TN cell reselection enhancements
Related specifications: Rel-17, Rel-18 discussions
Companies referenced: Transsion Holdings
Key concepts: Earth-moving cell, satellite orbital parameters, ephemeris data, cell reference location, UE measurement and reselection
Topics: Post124561feMob Intel Capability