№ files_lp_4_process_3_134047
This paper presents the thermal characterization of embedded cooling layers for passive heat extraction in power electronics, focusing on geometric, material, and thermal interfacial parameters for optimized thermal performance.
Year: 2014
Region / City: Orlando, Florida
Topic: Thermal Engineering, Power Electronics Cooling
Document Type: Conference Paper
Organization / Institution: University of Pretoria
Author: Jaco Dirker, Meyer J.P.
Target Audience: Researchers, Engineers, Academics in Thermal Management and Electronics Cooling
Effective Date: 6 – 9 July 2014
Date of Approval: July 2014
Date of Modifications: Not specified
Price: 8 / 10 USD
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