№ files_lp_4_process_1_45233
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Conference research summary describing a methodology that combines nanoindentation experiments and finite-element simulations to model plasticity and fracture behavior in brittle thin films used in semiconductor devices.
Year: Not specified
Event: Electronic Components and Technology Conference
Paper Number: 24.5
Field: Materials Science; Microelectronics
Topic: Mechanical properties and fracture behavior of thin films
Document Type: Conference paper summary
Authors: D. K. Lim et al.
Affiliated Institutions: National University of Singapore; Micron Technology
Materials Discussed: Silicon dioxide thin films; silicon nitride thin films
Methods: Nanoindentation experiments; finite-element analysis simulations
Application Area: Semiconductor and memory device manufacturing
Price: 8 / 10 USD
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Topics: Thin-Film Finite-Element Nanoindentation