№ files_lp_3_process_7_082035
File format: docx Character count: 1747 File size: 352 KB
The document describes the development and demonstration of an infrared laser debond technology for transferring silicon carrier wafers to silicon receiver wafers in 2.5D and 3D integration processes.
Year: 2026
Region / City: Not specified
Topic: 2.5D/3D Integration, Silicon Wafers
Document Type: Research Paper
Organization: Intel
Author: T. Sounart et al
Target Audience: Researchers, Engineers, Industry Professionals
Period of Validity: Not specified
Approval Date: Not specified
Date of Changes: Not specified
Price: 8 / 10 USD
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