№ lp_2_1_16094
File format: docx Character count: 12580 File size: 3972 KB
Procurement notice outlining technical specifications, performance criteria, contractual obligations, pricing structure, and submission requirements for acquisition of a sub-micron die attach and flip-chip bonding system for research and low- to mid-volume production applications.
Bid Number: DQ35003
Purchasing Agent: Elevate Quantum
E-Mail: [email protected]
Bid Due Date and Time: 02/16/2026, 5:00 PM (Mountain Time)
DQ Publication Date: 01/28/2026
Written Inquiry Deadline: 02/06/2026, 3:00 PM (MT)
Response Publication Deadline: No later than 02/09/2026, 5:00 PM (MT)
Submission Format: Electronic submission via e-mail with required signed documentation
Document Type: Invitation for Documented Quote (Request for Quotation)
Equipment Category: Sub-micron die attach and flip-chip bonding system
Primary Application: Advanced packaging and heterogeneous integration workflows
Bonding Process Focus: Epoxy-based die attach with optional solder-based bonding capability
Performance Requirement: ≤ 0.5 µm placement accuracy @ 3σ
Warranty Requirement: 3-year warranty
Service Contract Requirement: 3-year service contract
Installation and Training: Included in quotation
Process Environment Requirements: Enclosure, inert gas capability, optional reactive and reducing atmosphere compatibility
Software Requirements: Process parameter control, data logging, remote diagnostics, network connectivity
Shipping Destination: 18300 CO-72, Arvada, CO 80007
Insurance Requirement: Compliance with Exhibit A “Insurance Requirements”
Service Hours: Monday–Friday, 7:00 AM – 5:00 PM
Price: 8 / 10 USD
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