№ files_lp_4_process_3_132519
Technical meeting contribution summarizing RAN3 working group discussions on benefits, deployment considerations, and study areas related to Higher Layer Split in 6G disaggregated RAN architecture.
Year: 2026
Event: 3GPP TSG-RAN WG3 #131
Location: Goteborg, Sweden
Dates: 9–13 Feb 2026
Agenda Item: 10.4.1 Higher Layer Split (HLS)
Source: NTT DOCOMO INC. (moderator)
Document Identifier: R3-260662
Document Type: Meeting contribution
Organization: 3GPP TSG RAN Working Group 3
Topic: Higher Layer Split in 6G and disaggregated RAN architecture
Related Study Item: Higher Layer Split (HLS)
Referenced Documents: R3-260633; R3-260482
Key Technical Areas: CU–DU split architecture; UE context handling; control plane signalling; F1-U interface aspects; CU–DU capability exchange and coordination
Technological Domain: 6G mobile network architecture
Approval Status: Document for approval
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